The Only End-to-End Design-to-Yield Platform for Glass Substrate Chiplet Packaging
From target impedance to signoff GDSII in one API call. Cross-checked at 4.0% mean abs error against 6 in-scope coaxial-TGV papers.
The Problem
Glass Is Replacing Silicon. But No Design Tools Exist.
Intel Foveros Glass
Intel has announced glass substrate interposers for Foveros packaging. Through-glass vias (TGVs) replace TSVs with 10x better electrical properties -- but no EDA tool supports them.
TSMC InFO-Glass
TSMC's glass interposer program targets high-bandwidth chiplet integration. Engineers currently extrapolate from silicon TSV rules -- which are physically wrong for glass dielectrics.
Existing Glass Tools
Cadence Sigrity, Synopsys, and Ansys HFSS have zero glass PDK support. No material libraries. No TGV models. No impedance data. Engineers designing on glass are flying completely blind.
Architecture
Seven Stages. One API Call.
Each stage is independently validated, independently useful, and chained into a single design-to-yield pipeline.
Wafer Warpage
Kirchhoff-von Karman nonlinear plate solver. Proves rectangular panels are immune to radial artifacts.
Package Warpage
NLGEOM FEM-validated warpage prediction for CoWoS-L and glass panel substrates.
BEM Impedance
Boundary Element Method solver validated against 6 in-scope coaxial-TGV papers. 10ms per design point.
Isolation Synthesis
Closed-loop EM isolation compiler. 0/20 alternatives beat the synthesis loop.
Yield Prediction
FNO surrogate + physics guard rails. 10,000 LHS samples, 0 errors.
Thermal Analysis
Lattice Boltzmann + phase-field coupled thermal solver for chiplet hotspots.
EM Verification
Full S-parameter library. Drop into ADS, HFSS, or Sigrity for final signoff.
Crown Jewels
Four Assets No Competitor Can Replicate
Each asset required years of physics development and experimental validation. Together, they form an insurmountable moat.
BEM Impedance Solver
1,382 lines of validated physics. Benchmarked against 6 in-scope coaxial-TGV papers across 3 glass compositions. 10ms per design point -- faster than loading a Cadence license.
15.92M-Row Database
12 glass compositions, 5 metal systems, 10 frequency bands. Solver-generated static evidence index; not live measured VNA data and not validated in licensed vendor tools.
2,434 S2P Files
Complete S-parameter library in Touchstone format. Import directly into Keysight ADS, Ansys HFSS, or Cadence Sigrity. No reformatting. No re-simulation.
8 Golden Kits
UCIe, DDR5, PCIe Gen6, 400G SerDes, WiFi 7, Automotive Radar, HBM4, and custom. Each kit includes impedance targets, TGV geometry, and S-parameter signoff.
Competitive Landscape
Head-to-Head With Incumbent EDA
We are not competing with Cadence, Synopsys, or Ansys on silicon. We are building the tools they have not built -- and cannot build without our physics.
| Feature | Genesis | Cadence Sigrity | Synopsys | Ansys HFSS |
|---|---|---|---|---|
| Glass PDK Library | ||||
| TGV Impedance (BEM) | 10ms BEM | 3D FEM (hours) | No native support | 3D FEM (hours) |
| Glass Material DB | 15.92M rows | Manual input | Manual input | Manual input |
| S2P Library (Glass) | 2,434 files | Generate yourself | Generate yourself | Generate yourself |
| Yield Prediction | FNO + physics | |||
| EM Isolation Synthesis | Closed-loop | Manual sweep | Manual sweep | |
| Warpage (Rectangular) | Cartesian FEM | |||
| End-to-End Pipeline | 1 API call |
IP Protection
518 Filed Claims. 15 Attorney-Ready Disclosures.
Every stage of the pipeline is patent-protected. The glass PDK alone (PROV 7) contains 72 claims across BEM impedance methods, database indexing, S-parameter generation, and Golden Kit composition. Combined with PROV 8 isolation (72 claims) and PROV 1/2 yield/packaging (300+ claims), we have layered IP protection that would take 5+ years and $20M+ to design around.
View Full IP PortfolioUse Cases
Built for the Entire Glass Supply Chain
From glass manufacturers to foundries to chiplet designers -- every stakeholder needs glass-specific design tools.
Corning
Glass ManufacturerCorning and AGC are ramping glass substrate production for 2026-2028 chiplet interposers. They need to characterize electrical performance across their glass portfolio -- but lack semiconductor-grade design tools. Our platform ingests glass composition data and outputs impedance maps, S-parameter libraries, and yield predictions for every TGV geometry, enabling Corning to sell glass substrates with validated electrical datasheets instead of raw material specs.
KLA
Metrology / InspectionKLA's inspection tools detect defects but cannot predict yield impact. Our platform closes that loop: KLA metrology data (correlation length, roughness, via depth) feeds directly into our yield model, which returns pass/fail predictions with physics-based confidence intervals. The 10-wafer calibration protocol (CI<20um on correlation_length) means KLA can offer yield-aware inspection as a value-added service to every glass interposer fab.
TSMC
Foundry / OSATTSMC's InFO-Glass program (targeted 2028) needs design rules for glass TGV routing. Today, their design teams extrapolate from silicon TSV rules -- which are physically wrong for glass. Our BEM solver and Golden Kits provide TSMC-compatible design rules: impedance targets, keepout zones, and S-parameter signoff criteria calibrated to glass dielectric properties, not silicon assumptions.
Qualcomm
Chiplet DesignerQualcomm's Snapdragon chiplets require UCIe-compliant interposers with controlled impedance and sub-30dB isolation between RF and digital domains. Our platform delivers both: the BEM solver hits UCIe impedance targets in 10ms, and the isolation compiler synthesizes guard structures that exceed the 27dB requirement. One API call replaces a 3-month manual design cycle.
Start Designing on Glass Today
The free tier includes the BEM impedance calculator, yield screener, and full API documentation. No credit card required.