Defect
Taxonomy
33 expert-curated defect types from IPC-A-610G, SEMI E10, and ISO 9000-3. Every DRC violation, lot report, and CAPA recommendation in ChipletOS speaks this vocabulary, so quality teams at Absolics, DNP, Rapidus, Corning, and Intel can audit our outputs in their own language.
Total Codes
33
defect types
Families
14
IPC/SEMI groupings
Critical Tier
13
tier-1 defects
Glass-TGV Direct
24
directly applicable
| Code | Name | Family | Tier | Detection | Standard | TGV Relevance |
|---|---|---|---|---|---|---|
| VOID_SOL | Solder Void | Solder Joint | Elevated | AXI | IPC-A-610G | indirect |
| BRIDGING | Solder Bridging | Solder Joint | Critical | AOI/AXI | IPC-A-610G | indirect |
| TOMBSTONE | Component Tombstone | Solder Joint | Critical | AOI | IPC-A-610G | n/a |
| COLD_JOINT | Cold Solder Joint | Solder Joint | Elevated | AXI/Electrical | IPC-A-610G | indirect |
| VOID_WIRE | Wire Bond Void | Wire Bond | Critical | SAM | IPC-A-610G | direct |
| OPEN_BOND | Open Wire Bond | Wire Bond | Critical | Optical/Electrical | IPC-A-610G | direct |
| CRACK_DIE | Die Crack | Die | Critical | Optical/SEM | SEMI E10 | direct |
| SCRATCH_DIE | Die Surface Scratch | Die | Watch | Optical/SEM | SEMI E10 | direct |
| OPEN_PCB | PCB Open Circuit | PCB Trace | Critical | AOI/Electrical | IPC-A-610G | indirect |
| SHORT_PCB | PCB Short Circuit | PCB Trace | Critical | AOI/Electrical | IPC-A-610G | indirect |
| MOUSEBITE | Mousebite PCB | PCB Trace | Elevated | AOI | IPC-A-610G | indirect |
| SPUR | Copper Spur | PCB Trace | Elevated | AOI | IPC-A-610G | indirect |
| PINHOLE | Pin Hole | PCB Trace | Elevated | AOI | IPC-A-610G | indirect |
| PATTERN_CTR | Center Wafer Pattern | Wafer Map | Elevated | Parametric | SEMI E10 | direct |
| PATTERN_EDGE | Edge-Ring Wafer Pattern | Wafer Map | Elevated | Parametric | SEMI E10 | direct |
| PATTERN_LOC | Local Wafer Cluster | Wafer Map | Elevated | Parametric | SEMI E10 | direct |
| PATTERN_DONUT | Donut Wafer Pattern | Wafer Map | Elevated | Parametric | SEMI E10 | direct |
| PATTERN_SCRATCH | Scratch Wafer Pattern | Wafer Map | Critical | Parametric | SEMI E10 | direct |
| DELAM_PKG | Package Delamination | Package | Elevated | SAM | IPC-A-610G | direct |
| DELAM_BGA | BGA Delamination | BGA | Critical | AXI/SAM | IPC-A-610G | direct |
| WARP_PKG | Package Warpage | Package | Elevated | Shadow Moiré/CT | IPC-A-610G | direct |
| UNDERFILL_VOID | Underfill Void | Flip Chip | Elevated | SAM/CT | IPC-A-610G | direct |
| MISALIGN_DIE | Die Misalignment | Die Attach | Elevated | AOI | IPC-A-610G | direct |
| MISALIGN_BUMP | Bump Misalignment | Flip Chip | Elevated | SEM/X-Ray | IPC-A-610G | direct |
| CRACK_SUBS | Substrate Crack | Substrate | Critical | CT/Optical | IPC-A-610G | direct |
| SUBSTRATE_OPEN | Substrate Trace Open | Substrate | Critical | AOI/Electrical | IPC-A-610G | direct |
| DELAMTKL | Dielectric Stack Delamination | Stack | Critical | CT | IPC-A-610G | direct |
| CONTAM_PART | Particulate Contamination | Contamination | Watch | Optical | ISO 9000-3 | direct |
| CONTAM_IONIC | Ionic Contamination | Contamination | Elevated | Ion Chromatography | ISO 9000-3 | direct |
| WARP_WAFER | Wafer Warpage | Warpage | Watch | Wafer Bow | SEMI E10 | direct |
| HILLOCK | Metal Hillock | Surface | Elevated | SEM | SEMI E10 | direct |
| ELECTROMIG | Electromigration Void | Surface | Critical | SEM/TEM | SEMI E10 | direct |
| TEXTURE_ANOM | Surface Texture Anomaly | Surface | Watch | AOI/Optical | ISO 9000-3 | direct |
Live queryable at GET /v1/defects/search with filters for family, severity tier, detection method, and free-text description. MCP tool equivalent: search_defects(...).