Intellectual Property
909 Filed Subclaims. 9 Technology Areas.
280 utility filed Jan 2026 · 629 provisional · 146 independent · 0 issued to date · deadline 2027-01-31
Comprehensive IP covering glass interposer impedance, hybrid bonding yield prediction, isolation synthesis, wafer control, and thermal intelligence for advanced heterogeneous integration.
11 file-ready patent provisional bundles
Inverse design, Pareto optimization, fab-coupon export, per-regime calibration heads, lab readiness scoring, route-backed signoff, cross-solver consensus, adversarial verification, MCP agent pack, adjoint-BEM correlation, and provenance lineage — each with code-to-claim trace, §112 enablement evidence, retraction check, and counsel-ready cover memo.
Cross-physics calibration — 6 of 6 regimes deployed
Per-regime BEM-vs-Palace μ-correction cal heads close the gap between fast quasistatic and full-wave solvers. Latest retrain (2026-05-05) closes 72.5% of the pooled gap (17.10% → 4.71%) at an average 74.0% per-regime closure: ULTRA_HIGH_FREQ 90.5% (29.72% → 2.96%), HBM4 90.3% (13.06% → 1.42%), WIDE_PITCH 87.6% (10.26% → 1.52%), UCIE 81.6% (12.07% → 2.17%), EXTREME_TIGHT 50.6% (16.84% → 7.23%), MMWAVE 43.4% (20.64% → 12.95%). 4/6 regimes elite (>80% closure). Pattern reproduces across all regimes — tighter geometries calibrate cleaner; honest disclosure on the wide-distribution and mmWave regimes. Palace is full-wave FEM cross-physics truth, not VNA measurement.
Productization — 261 live API endpoints
Multi-objective Pareto inverse design · IPC/SEMI DRC validation · cross-solver matrix (100-geometry × 5-solver) · fab-coupon export (GDS + 12-layer stack-up + per-foundry SOW) · measurement validation with honest sim-vs-VNA disclosure. All endpoints pytest-covered with 1121 tests + buyer-runnable adversarial harness (100/100 pass + 30/30 OOD recall).
Highest-Value Independent Claims
Top 10 Claims
Full claim text, evidence, and buyer-specific analysis available under NDA.
Overlay Metrology → Yield via Spatial Autocorrelation
Yield Prediction EngineBridges overlay registration measurements to hybrid bonding yield prediction via pairwise autocorrelation and spatial defect correlation length.
Relevant to: KLA, ASML
End-to-End GDS-to-Yield Pipeline for Hybrid Bonding
Yield Prediction EngineSeven-stage physics chain from CMP recess to contact mechanics to void nucleation to thermal stress to Monte Carlo yield, with mandatory data contracts between stages.
Relevant to: Corning, KLA, TSMC
Multiconductor BEM for Through-Glass Via Impedance
Glass Interposer PDKBoundary-element multiconductor capacitance extraction for TGV arrays, capturing discrete ground-via placement effects that coaxial formulas cannot.
Relevant to: Corning, Intel, Cadence, Synopsys
Bayesian Sequential Calibration of Yield Model Parameters
Yield Prediction EngineConjugate Normal-Normal sequential updates over correlation length, CMP recess variance, and anneal stress, narrowing confidence intervals by 90% within 10 measurements.
Relevant to: KLA, Corning
Closed-Loop Adjoint Workflow for Isolation Synthesis
Isolation Synthesis EngineParameterizes isolation corridors as a 2D permittivity field, runs forward FDTD with adjoint gradient computation, and exports DRC-verified GDSII in a single closed loop.
Relevant to: Cadence, Synopsys, Qualcomm, Intel
Chirped LFI Dielectric Shield
RF & Photonics SuiteChirped TiO2/SiO2 dielectric stack providing broadband laser fault injection rejection above 40 dB at 532/808/1064 nm simultaneously with visible transmittance above 90%.
Relevant to: Defense, Qualcomm, Apple
Multi-Dk Inverse Impedance Design
Glass Interposer PDKAnalytical-seed plus BEM-verify iterative search for target characteristic impedance across glass substrates of varying dielectric constant.
Relevant to: Corning, Intel, Cadence
Differentiable Yield-Aware Inverse Layout
Yield Prediction EngineFourier Neural Operator backpropagation through density, density gradient, and CMP recess channels to optimize layout density patterns for predicted yield.
Relevant to: KLA, TSMC
Spectral FFT Contact with Smoothed Dugdale CZM
Yield Prediction EngineFourier-space elastic contact combined with smoothed Dugdale cohesive zone optimization to compute wafer bonding gap and void distribution.
Relevant to: Infrastructure for hybrid bonding yield prediction
Zernike-Decomposed Iterative Learning Control
Wafer Control SuiteNoll-normalized Zernike mode decomposition with order-dependent gain scheduling for iterative wafer flatness control in lithography.
Relevant to: ASML, Tokyo Electron
Lot Intelligence Report — 4-Signal Release Verdict
Quality / Inspection PlaneSystem and method for generating a manufacturing lot release recommendation by aggregating (a) IPC-A-610G / SEMI E10 / ISO 9000-3 defect taxonomy resolution, (b) WM-811K-derived yield-pattern hypotheses by process step, (c) ranked CAPA recommendations keyed by regulatory reference, and (d) a queryable provenance graph binding each output field to its source solver, dataset, and validation method.
Relevant to: Absolics, DNP, Rapidus, Corning QA, Intel Foveros, KLA
Provenance Graph Binding — Solver / Dataset / Validation Audit Trail
Quality / Inspection PlanePersistent provenance graph linking each manufacturing output field to a tuple of source solver, source dataset, validation method, and evidence path. Exposed via API for buyer audit.
Relevant to: All QA / compliance teams
Hand-Engineered Explainable BEM Fingerprint (128-dim pgvector, NEW, April 13)
Glass Interposer PDK128-dimensional fingerprint built from glass/metal/via one-hots + Z₀/IL/RL/L/C/R/G frequency sweep + derived physics scalars. Every bucket has human-readable meaning, unlike opaque ViT/CNN embeddings. Enables sub-10 ms ANN lookup across the 15.92M-row long-format BEM corpus.
Relevant to: Corning, EDA houses
Shape-Invariant Wafer-Map Fingerprint
Quality / Inspection PlaneRadial + angular + quadrant + zone + line-residual feature extraction producing a 128-dim classifier over wafer maps of arbitrary size (26×26 to 212×204 dies). Pairs with a trained CNN classifier over the same WM-811K corpus (811,457 real fab wafers, 9 failure classes).
Relevant to: KLA, Archer
DRC ↔ IPC/SEMI/ISO Taxonomy Mapping
Quality / Inspection PlaneEvery geometric DRC violation carries an optional IPC-A-610G / SEMI E10 / ISO 9000-3 `defect_code`, making the entire design-rule system speakable in buyer-QA-team language. Continuation claim of Rank 11.
Relevant to: All QA / compliance teams
Full claim text under NDA
Complete independent claim language, prosecution status, filing dates, evidence packages, and valuation analysis are available in the NDA data room.
Moat Depth
Design-Around Evidence
Each claim is backed by quantitative evidence that competitors cannot trivially replicate or circumvent the protected methods.
Wafer Control Suite
ILC vs 5 classical controllers (PID, LQR, MPC, SM, Fixed) — synthetic Monte Carlo
Control law non-trivially superior in 1,000-case analytical-plant simulation; hardware/FEM-in-loop validation future work
Glass Interposer PDK
BEM vs coaxial analytical across 41,700 TGV designs
Coaxial formula is 55–225% wrong on glass TGV geometries
Isolation Synthesis Engine
Adjoint gradient vs finite-difference validation (EM Isolation Compiler)
Adjoint gradient computation correct to numerical precision for energy FoM; spectral FoM within r>0.8 pass threshold.
Yield Prediction Engine
Overlay autocorrelation → yield calibration
Correlation length converges from 294µm to 12.4µm with no competing published method
Glass Interposer PDK
BEM vs 5 IEEE-published HFSS-coaxial reference points (not VNA)
Matches Eagle XG, AF32, Borosilicate, EN-A1, and Quartz HFSS-coaxial reference values within ±40-60% published-tolerance bands. measurements.json has 13 Z₀ entries (10 source_type=simulation + 1 measurement + 2 other) after Sprint 41 added 5 new papers. Real VNA campaign queued (~$200-500K wet lab).
Glass Interposer PDK
BEM vs FastHenry2 (LGPL, built from source)
20 geometries × 3 glasses × 3 frequencies. Z₀ 31.8–66.0 Ω, L 0.128–0.277 nH. Independent LGPL solver agrees.
Glass Interposer PDK
AWS Palace FEM (Apache-2.0) at correct excitation frequency
Root-caused extraction bug: source spectral power near zero at prior 28 GHz extraction frequency. Corrected at 10 GHz. Residual 20.7% is a factor-of-2 lumped-port convention.
Glass Interposer PDK
BEM mesh-convergence study (standalone physics claim)
BEM solver converges to a single answer independently of discretization — no cross-solver dependency. Standalone defensibility claim for due diligence.
Glass Interposer PDK
IEEE validation corpus extended
Tightens the headline 4.0% MAE figure with frequency-resolved data. Clean quasi-static BEM regime boundary at ~60 GHz.
Glass Interposer PDK
Local source-built OpenEMS high-band named matrix
OpenEMS is a real independent full-wave witness on a bounded named set. golden_50ohm and golden_mmwave_77ghz pass; tighter mmWave/HBM4/UCIe regimes await extraction sanity.
Quality / Inspection Plane
Lot Intelligence Report endpoint verified live
4-signal → 1-verdict aggregation works end-to-end against live production database.
Portfolio Coverage
9 Technology Areas
Each area combines production solvers, validated benchmarks, and independent claims filed with a January–February 2026 priority date.
Wafer Control Suite
Iterative learning control, wafer flatness, Zernike decomposition
Package Mechanics Engine
Kirchhoff-von Karman FEM, panel warpage, structural coupling
Thermal Intelligence Engine
Binary mixture thermal, Rohsenow boiling, 2D resolved thermal
RF & Photonics Suite
TMM wideband isolation, chirped LFI shields, photonic thermal
Critical Materials Engine
PFAS remediation cascades, rare-earth selectivity
Battery Physics Engine
Gyroid tortuosity, Monroe-Newman CCD, dendrite prediction
Glass Interposer PDK
BEM multiconductor impedance surrogate — R²=0.9999966 on 6.75M-row corpus, 23 commercial glasses, 4-solver cross-validation, per-prediction confidence intervals, 5/5 cross-EDA export
Isolation Synthesis Engine
Adjoint topology optimization, GDSII export, DRC integration
Yield Prediction Engine
GDS-to-yield pipeline, Bayesian calibration, KLA Archer integration
Quality / Inspection Plane
33-type IPC/SEMI/ISO defect taxonomy, 12-pattern CAPA library, WM-811K wafer-map corpus (811K real fab wafers), provenance graph, MCP tool server
For strategic partners and acquirers
Build-vs-buy infrastructure for AI-native EDA
909 filed patent claims spanning chiplet packaging, photonic ICs (ChipletOS Photonic Signoff sub-brand), multi-physics signoff, and bondability screening. AI-EDA distribution via ChipletOS-MCP (Anthropic gallery submission in flight). 39-entry retraction registry with root-cause documentation for every withdrawn claim. 17/17 validation suite gates passing at every commit.
One platform, two markets: chiplet packaging (today) and silicon photonics (build-out under the ChipletOS Photonic Signoff sub-brand). Synopsys-Lumerical-class photonic-EDA story without the silo — same surrogate stack, same audit gates, same cross-vendor exporter discipline.
For strategic discussion: nick@chipletos.com
Outside the chiplet stack
Sister Portfolio: FluxZero
Same ownership. Separately branded. FluxZero is a PFAS-free, Marangoni-active, self-pumping fluid built to replace 3M Novec in two-phase immersion cooling before EPA and EU restrictions take the incumbent off the market.
The two-phase immersion stack that cools GPU clusters, edge compute, and orbital electronics is about to lose its incumbent PFAS dielectric. EPA and EU restrictions are closing the door behind 3M's Novec discontinuation. FluxZero is the PFAS-free replacement: a fluid whose surface-tension gradient pumps itself across the boiling boundary without external work. Owned by ChipletOS; commercialized under its own brand.
Visit fluxzerofluid.com →Full Portfolio Under NDA
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