memoryBuilt for Intel

Foveros Glass 2026. Design Tools Ready.

The transition to glass interposers is 12 months away. No EDA vendor ships glass substrate design tools. ChipletOS does.

32+ validated solvers. 2.95M BEM simulation rows feeding 15.92M ML rows, plus 901K separately versioned strict buyer-regime additions. The only end-to-end design-to-yield platform for glass chiplet packaging.

Production surrogate model
R² 0.9999966 · MAPE 0.0292%
HBM4 MAPE 0.0154% · schema-complete 6.75M-row corpus · geometry-disjoint train/test split
60-case route-backed signoff
60/60 RF pass
Mean worst Z₀ 1.86% · max 6.65% (vs 24d 1.94% / 6.73%) · v3 wins on both
Wide-pitch closure: candidate grid 5×5→8×8 + tolerance 10%→12% (matches 800G/HBM4 routing practice).
External truth (IEEE 5-paper witness)
3.53% BEM mean abs error
Sukumaran · Watanabe · Shorey · Tummala · Hwang
4-solver cross-solver witness
BEM + FastHenry2 + OpenEMS + Palace
Per-prediction CI + OOD flag · Re-measurement on an 80K test slice: deployed pooled 0.79% ± 0.23% / HBM4 1.30% ± 0.16% (5-seed). Palace cross-solver: 28 GHz BEM-vs-Palace 4.71% (n=25) vs BEM-vs-Hwang 8.04% (n=1)
32+Production Solvers
3.57%MAE vs IEEE-published HFSS refs (not VNA)
15.92MBEM ML Rows
261API Endpoints
982/1000ILC Wins
909Patent Claims Filed
The Challenge

Glass Interposers Need New Design Tools

Foveros Glass 2026 marks Intel's transition from silicon to glass interposers. But the EDA ecosystem has not kept pace. Sigrity has no glass PDK. StarRC has no glass parasitic model. HFSS has no glass TGV library. The design gap is real and the timeline is tight.

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12-Month Window

Foveros Glass 2026 requires validated glass design tools that do not yet exist in any EDA vendor's roadmap.

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No Glass EDA Coverage

Zero glass substrate support across Cadence Sigrity, Synopsys StarRC, and Ansys HFSS. Silicon models do not transfer.

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ChipletOS: Ready Now

End-to-end glass design-to-yield platform. BEM impedance, isolation synthesis, thermal analysis, and yield prediction in one stack.

Foveros Glass Design Stack

01
BEM Impedance3.57% MAE vs IEEE-HFSS-coaxial refs (not VNA), 15.92M+ rows
02
Isolation SynthesisAdjoint optimizer, r=1.0 correlation
03
Thermal AnalysisGPU thermal for chiplet stacks
04
Yield PredictionPhysics + ML pipeline, KLA integration
05
EM VerificationS2P touchstone library
06
GDS-to-Yield100/100 layouts validated

Strategic Advantage

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First-Mover IP

909 filed subclaims / 146 independent claims across 9 technology areas. 12–18 months to replicate from scratch. The glass design tool IP position is uncontested.

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EDA Integration Ready

261 API endpoints. Allegro pin export, S2P touchstone output, EDA export workflow. Drop into existing Intel design flows.

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Production Validated

982 tests collected at repo root. ILC wins 982/1000 scenarios in a synthetic analytical-plant Monte Carlo. Bayesian yield calibration converging in 10 wafers to CI<20μm.

Platform at a Glance

Validated Solvers32+ Production
BEM Database15.92M Rows + 901K Versioned Strict Additions
API Endpoints261
Tests Collected982
ILC Controller982/1000 Synthetic
Patent Claims909+ Filed
Technology Areas9
12 Months

Until Foveros Glass 2026 — Design Tools Needed Now

Zero

EDA Vendors with Glass Substrate Design Coverage

ChipletOS

Only End-to-End Glass Design-to-Yield Platform

Foveros Glass Needs Design Tools. We Built Them.

Acquisition, licensing, or partnership — we are open to all structures. 15-minute demo or NDA data room access available immediately.

Productization fleet
5 net-new endpoints turning surrogate into fab studio
POST /v1/glass-pdk/geometry-pareto — multi-objective Pareto (Z₀ + IL + crosstalk + yield)
POST /v1/glass-pdk/drc-validate — IPC/SEMI defect codes
POST /v1/glass-pdk/validate-against-measurement — honest sim-vs-VNA flag
POST /v1/coupons/export-fab — GDS + 12-layer stack-up + per-foundry SOW + cost
GET /v1/glass-pdk/cross-solver-matrix — 100-geom × 5-solver disagreement
Per-regime cross-physics cal heads · v2-clean retrain (2026-05-05)
6/6 regimes deployed · ULTRA_HIGH_FREQ 90.5% · HBM4 90.3%
First successful cross-physics calibration on Genesis. Per-regime BEM-vs-Palace μ-correction across all 6 production regimes; pooled 17.10% → 4.71% (72.5% pooled gap closure, avg 74.0% across regimes, 4/6 elite >80%). Per-regime: ULTRA_HIGH_FREQ 90.5% · HBM4 90.3% · WIDE_PITCH 87.6% · UCIE 81.6% · EXTREME_TIGHT 50.6% · MMWAVE 43.4%. Pattern reproduces across 6/6 regimes — not a single-experiment artifact. Production OFF by default; activate via CHIPLETOS_PALACE_RESIDUAL_HEAD=1.
DD-grade coverage
95% conformal interval + per-axis OOD on every prediction
Every /v1/glass-pdk/predict-impedance response carries a distribution-free 95% Palace-truth coverage interval — HBM4 q=8.38 Ω, cov 94.46%; UCIE q=6.03 Ω, cov 95.41%; EXTREME_TIGHT q=35.10 Ω, cov 94.42%; WIDE_PITCH q=9.84 Ω, cov 94.44%; pooled fallback q=9.11 Ω — AND a per-axis OOD severity diagnostic across all 7 input axes (in/borderline/out per d/p/t/Dk/Df/freq/wall). Mathematical guarantee, not a marketing number — for the kind of buyer DD that needs a board-defensible Z₀ bound.
Distribution + ecosystem
30 MCP tools · 10 packaged agents · open-source diff-pair scaling law
MCP surface 11 → 30 wires the full production endpoint set into Claude Desktop / Cursor / Codex agents. 10 single-purpose agent JSONs shipped (HBM4 Signoff / Inverse Design / Coupon RFQ / DRC Fixer / Cross-Solver Verifier / Pareto Explorer / Yield Risk / Interface Signoff / Provenance Auditor / Glass PDK Assistant). Apache-2.0 OSS slice pip install glass-tgv-diffpair publishes the universal scaling law log(Z₀_diff)=0.338·log(sep/d), R²=0.918, n=2.1M across 5 commercial glasses — controlled-transparency open/closed split (closed: trained surrogate weights, per-regime cal heads, conformal quantiles, MNDA glass corpora, fab-coupon export).
Composite lab_readiness_score
One 0-100 score + verdict band on every prediction surface
Single buyer-facing 0-100 score on /predict-impedance + /geometry-from-target + /coupons/export-fab. Verdict bands: send_to_lab ≥95 · send_with_extra_qc 80-94 · hold 60-79 · reject <60. Pro-rata weights across 5 confidence checks (cross-solver 24 / conformal 24 / per-axis OOD 18 / public-data 18 / ensemble 16 = 100). Synthetic-noise injection deferred to post-VNA cycle so weights re-pro-rata to 5 active checks. Critical truth-data invariant: checks without measured signals contribute None and trigger partial_score=true rather than fabricated values — fab-coupon export refuses bundles when partial_score=true OR verdict ∈ {hold, reject}. 16/16 contract tests pass.
3/5 cross-solver matrix wired
BEM ✓ Palace ✓ FastHenry2 ✓ · OpenEMS / gprMax honest skip
100-geometry × N-solver disagreement matrix at 3 of 5 wired (plus 4/5 spot-checks at 1-geom and 10-geom scale): BEM always-available + Palace full-wave FEM + FastHenry2 inductance solver (Z₀ via L_FH + analytical cylindrical-coax C honestly disclosed as hybrid; dispatch key = FastHenry2_L_plus_analytical_C). OpenEMS + gprMax return None via try-import skip when binary not on PATH — never fabricates a number. OpenEMS install on M3 ARM is blocked on standard package managers; a ~1-3h source-build is queued. See Trust & Validation for the full fallback methodology.