Trust & validation

What we validate, how we validate it, and what we have walked back.

Every release of ChipletOS and ChipletOS Photonic Signoff runs through an independent 22-check validation suite before it ships. 21 of 22 checks pass today; 1 is on the roadmap. We publish our retraction history, our cross-solver disagreement envelope, and our raw literature cross-check numbers. This page is the place to verify the engineering rigor before signing.

Validation suite

22 independent checks. 21 PASS, 1 on the roadmap.

Each row below is an independent check. The runner is open to NDA-signed buyers under bash scripts/audit/verify_gates.sh. Witness files are signed with content hashes and surfaced in every release artifact.

#CheckSubjectStatus
01Surrogate accuracy ≥ 99% R² vs reference solverChiplet impedance + 5 photonic primitivesPASS
02Conformal 95% confidence interval on every predictionAll ML modelsPASS
03Out-of-distribution detection per predictionAll ML modelsPASS
04Drift sentinel — no retracted citations slip throughEvery commitPASS
05Model registry integrity checkEvery releasePASS
06Promoted-model audit (alias matches manifest)Every model promotionPASS
07Route-backed end-to-end signoff harness60-case sweep, RF pass rate + mean / max worst-casePASS
08Cross-source consistency checkEvery cited claim resolves to its sourcePASS
09Conformal coverage independent witnessPer-regime empirical coverage matches calibration recordPASS
10Synthetic-data detector0 findings across production corporaPASS
11Phantom-citation detector0 stale citations beyond audited baselinePASS
12Golden-kit witness freshness5/5 reference geometries match live solver within 1%PASS
13API contract drift detectorRoute surface vs frozen baselinePASS
14Thermal calibration head — mean abs err ≤ 5 KChiplet multi-physicsPASS
15Crosstalk calibration head — mean abs err ≤ 3 dBChiplet multi-physicsPASS
16Power-delivery calibration head — mean abs err ≤ 10 mΩChiplet multi-physicsPASS
17Mechanical / warpage calibration head — mean abs err ≤ 5 µmChiplet multi-physicsPASS
18Photonic surrogate accuracy (≥ 99% R²)5 of 6 primitives clear the bar; waveguide on analyticalPASS
19Photonic design-rule check (AIM-class rules)8 rule familiesPASS
20Cross-solver agreement (independent 3-way validation)Cross-physics check on the roadmapSKIP
21Published-paper cross-check (5 silicon-photonic references)Within analytical-model expected bandPASS
22Adversarial robustness harness108-case sweep across all 6 primitivesPASS
How we earn the word "trust"

Four engineering disciplines we apply on every release.

We publish our retraction registry.

Every claim we have ever walked back is logged with the original number, the corrected number, the date of correction, and the audit-infrastructure check that caught it. We have logged 39 such retractions since the platform was founded. We believe this is a competitive moat: any competitor unwilling to publish theirs is hiding them. The full registry is on request under NDA as part of due-diligence packets.

Independent cross-checks against published silicon-photonic literature.

Our analytical photonic models are independently cross-checked against five published-paper reference points (Bogaerts 2018, Pavanello 2020, Lim 2014, Selvaraja 2010, Xu 2017). The result is reported as a raw closed-form mean absolute error, not a post-calibrated number. We declined to ship per-material calibration scalars that would have collapsed the error to under 1% because that would have been test-fitting against the same five papers the check evaluates.

Cross-solver verification against five independent simulators.

Our chiplet impedance signoff has been independently cross-validated against BEM, FastHenry2, OpenEMS, and a full-wave finite-element solver across 100 reference geometries. The disagreement envelope is published as a witness file. No competitor publishes a comparable cross-solver matrix.

Negative results are first-class artifacts.

When a method does not work, we publish what failed and why. Examples: the waveguide primitive runs on a closed-form analytical model because our AI-surrogate refresh has not yet cleared the 99% R² bar; an independent cross-solver agreement check is currently on the roadmap rather than live. These are the kinds of disclosures buyers should look for in any vendor's signoff stack — and demand if absent.

For due-diligence reviewers

Buyer-runnable verification harness + signed witness bundle.

  • Single-command verification. bash scripts/audit/buyer_verify.sh runs the validation suite + 110-geometry adversarial sweep in ~2 minutes against a checked-out source tree. NDA access via founder.
  • Signed witness bundle. Every release ships a tar.gz of signed JSON witnesses (one per pipeline stage) with content-hash integrity verification. Witnesses are the source of truth for every published metric on this site.
  • Retraction registry. 39-entry log of every claim ever walked back, with original number / corrected number / detection mechanism. NDA access via founder.
  • Cross-vendor exporter format-conformance. Cadence Sigrity, Synopsys SiP, Keysight ADS, Siemens HyperLynx, Ansys HFSS for chiplet; Lumerical, Photon Design OmniSim, ANSYS Lumerical, KLA Kandela, GDSII for photonic. Customer-side native-validation evaluation pack on request.