Glass Is the Next Interposer. No EDA Tool Supports It.
Intel Foveros 2026 and TSMC InFO-Glass 2028 are both transitioning to glass substrates. Your glass design tool coverage today: zero.
No StarRC glass parasitic model. No HFSS glass TGV library. The foundries are moving and the EDA tools have not followed. The gap is 12–18 months to replicate from scratch.
The Foundries Are Moving to Glass
Intel Foveros Glass 2026. TSMC InFO-Glass 2028. Samsung I-Cube4 evaluating glass. The substrate transition is happening. StarRC and HFSS have silicon interposer models but zero glass models. The gap between foundry roadmaps and EDA tool coverage is widening.
No Glass Parasitic Extraction
StarRC has no glass-specific material models. Silicon parasitic models do not transfer to glass TGV geometries.
No Glass TGV Library in HFSS
HFSS electromagnetic simulation has no glass via library. The BEM solver could serve as a glass extraction engine.
ChipletOS BEM as Extraction Engine
Integrate the 3.57% MAE BEM solver (calibrated against IEEE-published HFSS-coaxial reference points; not VNA) as a glass parasitic extraction backend for StarRC or HFSS glass workflows.
Integration Architecture
The AI-EDA distribution layer Lumerical doesn't have
Synopsys owns Lumerical (~$80M photonic-EDA revenue) but ships no AI-native distribution surface for it. ChipletOS Photonic Signoff is the same MCP / Cursor / Claude.ai distribution layer the chiplet stack already runs on — applied to silicon photonics. Six primitives (waveguide / MZI / MMI / ring / grating / photonic crystal), 40 total /v1/photonics/* routes (incl. PROV4 RF), AIM-Photonics-class DRC, AI surrogate live for 5 of 6 primitives at R² ≥ 0.99 vs reference solver (cross-solver agreement on roadmap); waveguide on closed-form analytical fallback (reference-solver ceiling 0.93). One platform, two markets: chiplet packaging + silicon photonics — same surrogate stack, same audit gates, same cross-vendor exporter discipline.
Partnership Structures
Licensing
License the BEM solver as a glass extraction engine embedded in HFSS or StarRC. 261 API endpoints provide full programmatic integration. Your customers get glass coverage without switching tools.
Acquisition
Valuation, replication cost analysis, and comparable transactions available under NDA. 909 filed subclaims / 146 independent claims, 15.92M+ BEM ML rows plus 901K separately versioned strict buyer-regime additions, 32+ solvers.
Co-Development
Joint roadmap to build the first glass-native EDA module. ChipletOS provides the physics kernel. Synopsys provides the user interface and foundry relationships. 12–18 month head start over building from scratch.
Evidence-Backed Portfolio
Every claim is backed by reproducible benchmarks against IEEE-published HFSS-coaxial reference points (note: published references are HFSS-coaxial extractions per measurements.json::source_type=simulation, not VNA — real VNA campaign queued, ~$200-500K wet lab). Full evidence package including provenance disclosure, prosecution status, and filing documentation available in the NDA data room.
Guided live demos expose the impedance calculator, yield risk screener, ROI calculator, and Digital Twin Verdict. They show selected product surfaces, not unrestricted access to the full API.
Full benchmark evidence, filing packages, prosecution status, and replication cost analysis. Available within 24 hours of request.
BEM impedance result in under 100 milliseconds. Coaxial approximation delta shown side-by-side. 982 tests collected at repo root.
Glass Is Coming to Your Tools. We Built the Engine.
15-minute demo or NDA data room access. Full benchmark evidence, prosecution status, and replication analysis included.
source_type badge. Buyer-DD friendly.POST /v1/glass-pdk/geometry-pareto — multi-objective Pareto (Z₀ + IL + crosstalk + yield) — replaces manual sweeps in HFSSPOST /v1/glass-pdk/drc-validate — IPC-A-610G / SEMI E10 / ISO 9000-3 defect codesPOST /v1/glass-pdk/validate-against-measurement — surrogate-vs-literature with honest sim-vs-VNA flagPOST /v1/coupons/export-fab — GDS + 12-layer stack-up + per-foundry SOW + cost bandGET /v1/glass-pdk/cross-solver-matrix — 100-geom × 5-solver disagreementCHIPLETOS_PALACE_RESIDUAL_HEAD=1./v1/glass-pdk/predict-impedance response carries a distribution-free 95% Palace-truth coverage interval — HBM4 q=8.38 Ω, cov 94.46%; UCIE q=6.03 Ω, cov 95.41%; EXTREME_TIGHT q=35.10 Ω, cov 94.42%; WIDE_PITCH q=9.84 Ω, cov 94.44%; pooled fallback q=9.11 Ω — AND a per-axis OOD severity diagnostic across all 7 input axes. For Synopsys signal-integrity workflows, the surrogate becomes a drop-in pre-screen with provable error bounds before the HSPICE / PrimeSim handoff.pip install glass-tgv-diffpair publishes the universal scaling law log(Z₀_diff)=0.338·log(sep/d), R²=0.918, n=2.1M across 5 commercial glasses — controlled-transparency open/closed split (closed: trained weights, cal heads, conformal quantiles, MNDA glass corpora, fab-coupon export)./predict-impedance + /geometry-from-target + /coupons/export-fab. Verdict bands: send_to_lab ≥95 / send_with_extra_qc 80-94 / hold 60-79 / reject <60. Pro-rata weights across 5 confidence checks (cross-solver 24 + conformal 24 + per-axis OOD 18 + public-data 18 + ensemble 16 = 100). Synthetic-noise injection deferred to post-VNA cycle. No fabricated proxy values: any gate without a measured signal contributes None and triggers partial_score=true; fab-coupon export refuses bundles when partial_score=true OR verdict ∈ {hold, reject}. Synopsys SI engineers receive a single number that gates whether to pre-screen with the surrogate or burn full PrimeSim cycles.benchmarks/sprint42/cross_solver_matrix_{1geom,10geom}_4of5_2026_05_01.json). BEM always-available + Palace via spack-installed binary + FastHenry2 via local fasthenry binary (Z₀ = √(L_FH / C_analytical_coax) honestly disclosed as hybrid; dispatch key = FastHenry2_L_plus_analytical_C). OpenEMS + gprMax return None via try-import skip when binary not on PATH — never fabricates a number. Witness: docs/HONEST_FALLBACKS.md Fallback 5.