About ChipletOS

What we ship

• A multiconductor BEM solver calibrated to 4.0% mean absolute error vs 6 in-scope coaxial-TGV literature reference points.
• A production ML surrogate (3-seed deep ensemble + learned calibration head) with per-prediction confidence intervals and OOD flags.
• Per-substrate cal heads correcting BEM-to-Palace full-wave FEM drift across 6 design regimes.
• Multi-port S-parameter signoff (RLGC → ABCD cascade), GDSII import, and EDA exporters for HFSS, Sigrity, ADS, HyperLynx, and SPICE.
• A unified design-to-yield API that chains TGV impedance, EM isolation, and bondability yield in a single call.

Why we built it

Glass substrate adoption is accelerating but no commercial EDA tool ships a glass-specific PDK. Customers evaluating glass coupons from substrate vendors stall on "how do I design on glass?" We built the substrate-agnostic design layer that closes that gap and extends to every advanced-packaging substrate.

Provenance

Every prediction is bound to a SHA-256-hashed witness. Every claim links to a model card, dataset manifest, and external-validation status. We publish honest disclosure of what is simulation-validated vs measurement-validated.

For strategic partners and acquirers

ChipletOS is build-vs-buy infrastructure for the AI-native EDA era. The platform combines a parameterized glass-TGV PDK (no other commercial vendor ships one), a 4-substrate-class surrogate model with R²=0.9999966 vs BEM truth, 5/5 cross-EDA-vendor format exporters (Cadence Sigrity, Synopsys SiP, Keysight ADS, Siemens HyperLynx, ANSYS HFSS), 6/6 deployed multi-physics calibration heads, 17/17 validation suite gates passing at every commit, a 39-entry retraction registry with root-cause documentation, and 909 filed patent claims spanning chiplet packaging, photonic ICs (ChipletOS Photonic Signoff sub-brand), multi-physics signoff, and bondability screening.

For strategic discussion: nick@chipletos.com

Operator

ChipletOS · hello@chipletos.com