SOLUTIONS
Signoff for Chiplet Manufacturing
Two signoff surfaces under one audit-gated platform: glass-substrate chiplet packaging and silicon-photonics IC design.
4.0%
BEM MAE vs Literature
Glass Interposer Design Suite
The only end-to-end design-to-yield platform for glass-substrate chiplet packaging. BEM impedance solver calibrated to 4.0% mean absolute error vs 6 in-scope coaxial-TGV papers. 15.92M-row training corpus, 995 curated S-parameter assets, 8 Golden Kits.
6
Photonic Primitives
Silicon Photonics Signoff
ChipletOS Photonic Signoff sub-brand. Photonic IC signoff for silicon-photonics designers — 6 primitives, 40 total /v1/photonics/* surface, AIM-Photonics-class DRC. Research Preview: analytical physics engine (~21% mean error vs FDFD-grade references); trained surrogate pending FDTD corpus. Same audit gates as the chiplet stack.