Three Reference Deployments

Corning sells Eagle XG glass for advanced packaging, but customers cannot predict TGV impedance accurately. The standard coaxial approximation is wrong by ~55% — designers either over-engineer or fail at integration.

Genesis BEM solver calibrated against 6 in-scope coaxial-TGV papers (4.0% in-scope mean abs error), driven by 995 active curated unique Touchstone S2P assets in a 2,480-entry registry covering golden TGV geometries and buyer kits. The kit ships as a single YAML config that compiles to GDSII in under one second.

A drop-in design kit covering UCIe @ 32 GT/s, DDR5 @ 6.4 Gbps, PCIe Gen6, and 400G Ethernet. Each interface comes with pre-validated Touchstone, eye diagrams, and a one-page signoff brief.

KLA Archer overlay metrology produces dx,dy displacement maps for every wafer, but no commercial tool maps those measurements directly to bonding yield. Engineers eyeball trends and burn weeks of pilot wafers before catching drift.

Genesis extracts a correlation_length parameter from the Archer dx,dy maps, then runs Bayesian Normal-Normal calibration. A 10K-campaign DOE proves that just 10 wafers are enough to drive the correlation_length confidence interval below 20µm.

First overlay-to-yield bridge in production. Convergence in 10 wafers vs typical 100+ for fingerprinting approaches. A new ramping fab can establish a yield model in one shift.

UCIe @ 32 GT/s on glass substrates has zero EDA tool support. Engineers fly blind: there is no signoff path from layout through impedance, isolation, yield, thermal, and EM verification.

Full digital_twin pipeline — impedance synthesis (PROV 7) → isolation closed-loop (PROV 8) → yield (PROV 9) → thermal (PROV 3) → EM verification. Each stage has a hard pass/fail gate that produces a per-design GO / NO-GO verdict.

A 5-stage verified design flow. 0 of 20 alternative isolation approaches beat the closed-loop synthesis (24.6 dB gap) — the closed loop is the only path that meets UCIe isolation targets on glass.