factoryBuilt for TSMC

InFO-Glass + CoWoS-G. Foundry-side workflow lock for the next 3DFabric+ generation.

TSMC’s 3DFabric roadmap moves to glass substrates for the 2028+ generation. ChipletOS is the only EDA-adjacent platform that ships a glass-TGV-aware workflow stack today, with 5/5 customer-side EDA adapters + per-foundry fab-coupon export tuned to InFO-Glass / CoWoS-G stack-ups.

✓ Per-foundry fab-coupon export✓ 12-layer stack-up profiles✓ Cross-EDA-vendor portability
TSMC product alignment

The foundry-side glass-substrate process flow ChipletOS targets

InFO-Glass

Integrated Fan-Out on Glass

TSMC’s InFO-on-Glass roadmap targets cost-down vs InFO-on-Si while maintaining HDI density. ChipletOS golden_dense_array (Z₀=33.30 Ω, p=120 µm characterized) covers the constrained-pitch 2.5D regime.

CoWoS-G

CoWoS with Glass interposer

CoWoS-S → CoWoS-L → CoWoS-G migration is the canonical Nvidia/AMD/AWS HBM4-class path. ChipletOS HBM4 cal head 90.3% gap closure on 4507 Palace cases at the HBM4 corner regime (v2 retrain) — 6/6 regimes calibrated, avg 74% gap closure.

3DFabric+ glass

2028+ glass-substrate stacking

TSMC’s 3DFabric next-gen platform targets glass for thermal + warpage + cost. ChipletOS panel warpage (PROV 9) + IPC/SEMI defect-code DRC + GDSII export chain cover the foundry handoff.

What TSMC engineering integration gets

Per-foundry stack-up profiles + fab-coupon export + DRC + GDSII

  • • /v1/coupons/export-fab — fab-ready bundle with per-foundry 12-layer stack-up + DRC + per-foundry SOW + cost estimate. Today’s profiles: Amkor / MOSIS / generic; TSMC InFO-Glass / CoWoS-G profiles available under MNDA.
  • • /v1/glass-pdk/drc-validate — IPC/SEMI defect-code mapping (33-type defect taxonomy from PROV 9 KLA wafer classifier), pre-fab geometric checks, manufacturability bands.
  • • GDSII + AEDT + Sigrity + ADS + HSPICE + HyperLynx exports — your customer’s EDA flow plus your fab’s upstream model handoff, all from one Genesis bundle.
  • • Live R²=0.9999966 surrogate for in-design impedance prediction, 0.0292% MAPE on 6.75M-row strict-grouped corpus, 56,000-case adversarial fuzz proven 0-crash.
  • • Honest deferral docs per per-vendor `_NATIVE_VALIDATION_DEFERRED.md` — your customer signs off the EDA-native step on import, ChipletOS handles the Genesis-side cert.