factoryBuilt for Samsung Foundry

I-Cube + H-Cube on glass. 3D-IC HBM4 stacks. Foundry-side workflow lock.

Samsung Foundry’s I-Cube → I-Cube-G + H-Cube → H-Cube-G migration competes with TSMC CoWoS-G. Both target glass interposers for HBM4-class memory + AI-accelerator packaging. ChipletOS is the only EDA-adjacent platform that ships a glass-TGV-aware workflow stack today.

✓ I-Cube + H-Cube coverage✓ Customer-EDA portability✓ HBM4 cal head 90.3% · 6/6 regimes
Samsung Foundry product alignment

The 3 Samsung Foundry packaging products that hit glass substrates by 2027-28

I-Cube → I-Cube-G

2.5D interposer migration

Samsung’s I-Cube4 (4-stack HBM) ramped on Si interposer. I-Cube8 candidates target glass interposer for cost-down + thermal headroom. ChipletOS UCIE cal head 81.6% gap closure on the chiplet-to-chiplet regime (v2 retrain).

H-Cube → H-Cube-G

3D HBM4 stack on glass

H-Cube targets HBM4-class memory stacking with AI-accelerator-die-on-bottom. Glass interposer is the substrate of choice for thermal + warpage reasons. ChipletOS HBM4 cal head 90.3% gap closure on 4507 Palace cases at 50 GHz (v2 retrain) — 6/6 regimes deployed, ULTRA_HIGH_FREQ ties HBM4 at 90.5%.

3D-IC custom-foundry

Custom-glass-substrate per-customer flows

Samsung Foundry’s custom-design service builds bespoke 3D-IC packages for hyperscalers + custom AI silicon. ChipletOS per-foundry fab-coupon export covers Samsung-specific 12-layer stack-up profiles (under MNDA).

Samsung-side EDA portability

Your customers’ EDA stacks → ChipletOS bundle → your fab

Samsung Foundry customers run the full spectrum of EDA tools. Apple/Qualcomm tend Cadence-heavy; Nvidia/AMD lean Synopsys + Ansys; Asia ecosystem heavy on Siemens. ChipletOS’s 5/5 cross-EDA workflow lock means customers can hand you a Genesis-emitted bundle from ANY of those EDA stacks.

  • • Cadence Sigrity → Genesis CSV roundtrip cert (5 pytest contracts) → your I-Cube fab
  • • Synopsys SiP/HSPICE → Genesis .lib + CSV roundtrip cert (6 contracts) → your H-Cube fab
  • • Ansys HFSS/AEDT → Genesis IronPython script + XML roundtrip (6 contracts) → 3D-IC custom flow
  • • Keysight ADS/Momentum → Genesis .net + CSV roundtrip (6 contracts) → mmWave RF packaging
  • • Siemens HyperLynx/PADS → Genesis FDML CSV roundtrip (6 contracts) → digital signal-integrity

All 29 cross-vendor pytest contracts PASS + 250-cell grid stress + 50 multi-pole Debye stress + 8 malformed-input fuzz cells = 337+ adapter-cell verifications. Each vendor’s native validation honestly customer-deferred per per-vendor `_NATIVE_VALIDATION_DEFERRED.md` doc.