Substrate signoff from geometry to evidence report

Geometry + material + target → impedance, OOD, inverse alternatives, isolation, yield, solver disagreement, evidence report, next validation step.

Explore substrate TGV impedance and inverse candidates, then escalate the design into the evidence-linked signoff workflow.

Sister sub-brand to the chiplet glass-TGV PDK. Waveguide + ring alpha live via a closed-form analytical model (5-15% relative error vs full-wave reference solver); trained AI surrogate v1 on roadmap.

Trace claim state, model cards, dataset provenance, witness JSON, and external validation blockers before using a result in a report.

Paste any output and inspect the solver, dataset, validation, and pending-external chain behind each buyer-visible number.

Isolation and keepout screening with explicit caveats until external validation artifacts are attached to scoped claims.

Bondability and yield-risk screening linked into the design-to-yield decision and evidence report.

Lot-level process signals remain available as companion context, not the first buyer-signoff surface.

Wafer-pattern analytics stay disclosed as separate workflow support, not glass-package external validation.

Multi-stage analysis stays behind the primary signoff workflow unless its outputs are linked to the live evidence report.